US Patent Issued to Rohm and Haas Electronic Materials CMP Holdings on Jan. 20 for "CMP pad having ultra expanded polymer microspheres" (Delaware Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,152, issued on Jan. 20, was assigned to Rohm and Haas Electronic Materials CMP Holdings Inc. (Newark, Del.).

"CMP pad having ultra expanded polymer microspheres" was invented by Nan-Rong Chiou (Wilmington, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such e...