US Patent Issued to Rohm and Haas Electronic Materials, Dow Global Technologies on Aug. 26 for "Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides" (Chinese, Chinese, American Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,479, issued on Aug. 26, was assigned to Rohm and Haas Electronic Materials LLC (Marlborough, Mass.) and Dow Global Technologies LLC (Midland, Mich.).

"Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides" was invented by Weijing Lu (Fanling, Hong Kong), Lingli Duan (Pudong District, China), Zukhra Niazimbetova (Westborough, Mass.), Chen Chen (Pudong District, China) and Maria Rzeznik (Shrewsbury, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copp...