US Patent Issued to Rockwell Collins on March 17 for "Integrating input and output capacitance with high frequency shunt capacitance on a single additively manufactured substrate" (Iowa Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,007, issued on March 17, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"Integrating input and output capacitance with high frequency shunt capacitance on a single additively manufactured substrate" was invented by Orion D. Davies (Cedar Rapids, Iowa) and Haley M. Steffen (Cedar Rapids, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is described. The package includes a die covered by a lid. The lid maintains a hermetic seal for the die. The package includes high frequency shunt capacitance in parallel with surface-mount capacitors. The high frequency shunt capacitance is formed by interdigital capacitors below the surfac...