US Patent Issued to Rockley Photonics on July 14 for "Coupon wafer and method of preparation thereof" (Irish, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,236, issued on July 14, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).

"Coupon wafer and method of preparation thereof" was invented by Mohamad Dernaika (Cork, Ireland), Frank Peters (Cork, Ireland) and Guomin Yu (Glendora, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coupon wafer comprising a device coupon (110) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (124), and the device coupon (110) is attached to the wafer substrate via a tether (122) and the tether (122) is formed from a dielectric material."

The patent was filed on Mar...