US Patent Issued to RICOH, LID. on Feb. 10 for "Heat sink and method of manufacturing same, heat exchanger, and gyroid structure component and method of manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,298, issued on Feb. 10, was assigned to RICOH COMPANY, LID. (Tokyo).

"Heat sink and method of manufacturing same, heat exchanger, and gyroid structure component and method of manufacturing same" was invented by Tomoko Satoh (Kanagawa, Japan) and Masato Tsuji (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink includes a channel including a gyroid structure portion having a non-uniform thickness."

The patent was filed on Nov. 4, 2022, under Application No. 18/052,584.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtm...