US Patent Issued to RF360 Singapore on April 14 for "Bulk acoustic wave devices having electrodes with acoustic impedance gradients to improve coupling efficiency and related fabrication methods" (German, Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,632, issued on April 14, was assigned to RF360 Singapore Pte. Ltd. (Republic Plaza, Singapore).

"Bulk acoustic wave devices having electrodes with acoustic impedance gradients to improve coupling efficiency and related fabrication methods" was invented by Veit Meister (Unterhaching, Germany), Maximilian Schiek (Puchheim, Germany), Juha Sakari Ella (Turku, Finland), Edgar Schmidhammer (Stein an der Traun, Germany) and Christian Ceranski (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "BAW devices include a piezoelectric layer with a first electrode layer on one face and a second electrode layer on the opposite face. The piezoelectric layer and...