US Patent Issued to Resonac Packaging on Sept. 8 for "Packaging material for power storage device, packaging case for power storage device, and power storage device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,834, issued on Sept. 8, was assigned to Resonac Packaging Corp. (Hikone, Japan).

"Packaging material for power storage device, packaging case for power storage device, and power storage device" was invented by Naoya Koda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging material for a power storage device includes a laminated material. The laminated material is composed of a metal foil layer, a substrate layer provided on an outer surface side of the metal foil layer, and a heat-fusible resin layer provided on an inner surface side of the metal foil layer. The heat-fusible resin layer is arranged on an inner surface side of the packa...