US Patent Issued to Resonac on Sept. 2 for "Encapsulating material for compression molding and electronic part device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,420, issued on Sept. 2, was assigned to Resonac Corp. (Tokyo).

"Encapsulating material for compression molding and electronic part device" was invented by Dongchul Kang (Tokyo) and Seigo Okubo (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region correspondi...