US Patent Issued to RESONAC on Oct. 20 for "Resin composition, film and cured product" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,784, issued on Oct. 20, was assigned to RESONAC Corp. (Tokyo).

"Resin composition, film and cured product" was invented by Takaya Yamamoto (Tokyo), Saori Mizunoe (Tokyo), Shota Umezaki (Tokyo), Masaki Takeuchi (Tokyo) and Yasuhisa Ishida (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition includes an insulating filler having a specific gravity of 6.0 or higher; and a resin having a polar group, in which a content of the insulating filler having a specific gravity of 6.0 or higher is 50% by volume or more with respect to a total solid content of the resin composition."

The patent was filed on March 25, 2020, under Application N...