US Patent Issued to Resonac on March 3 for "Slurry, polishing method, and method for manufacturing semiconductor component" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,599, issued on March 3, was assigned to Resonac Corp. (Tokyo).

"Slurry, polishing method, and method for manufacturing semiconductor component" was invented by Shigeki Kubota (Tokyo), Tomohiro Iwano (Tokyo), Satoshi Furukawa (Tokyo), Koichi Kagesawa (Tokyo) and Atsuko Ueda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry containing: abrasive grains; a compound X; and water, in which the abrasive grains contain cerium oxide, and a hydrogen bond term dH in Hansen solubility parameters of the compound X is 15.0 MPa1/2 or more. A polishing method including polishing a surface to be polished by using this slurry."

The patent was filed on S...