US Patent Issued to RESONAC on March 3 for "Copper paste for joining, method for manufacturing joined body, and joined body" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,879, issued on March 3, was assigned to RESONAC Corp. (Tokyo).

"Copper paste for joining, method for manufacturing joined body, and joined body" was invented by Motohiro Negishi (Tokyo), Hideo Nakako (Tokyo), Michiko Natori (Tokyo), Dai Ishikawa (Tokyo), Chie Sugama (Tokyo) and Yuki Kawana (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manuf...