US Patent Issued to RESONAC on March 17 for "Material design apparatus, material design method, and material design program" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,331, issued on March 17, was assigned to RESONAC Corp. (Tokyo).

"Material design apparatus, material design method, and material design program" was invented by Naoto Aonuma (Tokyo), Shimpei Takemoto (Tokyo), Eriko Takeda (Tokyo), Yoshishige Okuno (Tokyo), Hiroki Kuramoto (Tokyo) and Yasuaki Kawaguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material design apparatus includes a learned model that has learned a correspondence between input information about a blend proportion of a monomer and output information about physical property values of a polymer by machine learning. Each unit of the material design apparatus is configured to:...