US Patent Issued to Resonac on June 3 for "Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,105, issued on June 3, was assigned to Resonac Corp. (Tokyo).

"Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package" was invented by Chihiro Hayashi (Tokyo), Minoru Kakitani (Tokyo), Takao Tanigawa (Tokyo), Ryuji Akebi (Tokyo), Naoyoshi Sato (Tokyo) and Akira Horie (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elasto...