US Patent Issued to RESONAC on July 14 for "Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,386, issued on July 14, was assigned to RESONAC Corp. (Tokyo).

"Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board" was invented by Naomitsu Komori (Tokyo), Shuji Nomoto (Tokyo), Akihiro Nakamura (Tokyo) and Hayato Sawamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunc...