US Patent Issued to Resonac on July 14 for "Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,089, issued on July 14, was assigned to Resonac Corp. (Tokyo).

"Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure" was invented by Kenta Kikuchi (Tokyo), Hiroyuki Izawa (Tokyo), Takashi Tatsuzawa (Tokyo), Mayumi Sato (Tokyo), Yasuo Maehara (Tokyo), Hiroshi Takaira (Tokyo), Takahiro Fukui (Tokyo), Katsuhiko Tomisaka (Tokyo) and Toshiaki Matsuzaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A production method for an adhesive sheet for semiconductor device production including: preparing a backing material-attached laminated body including a laminated body and a backing material; a lam...