US Patent Issued to RESONAC on Feb. 17 for "Polyamideimide resin composition and method for producing polyamideimide resin" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,960, issued on Feb. 17, was assigned to RESONAC Corp. (Tokyo).

"Polyamideimide resin composition and method for producing polyamideimide resin" was invented by Yasuyuki Saito (Tokyo), Atsushi Takahashi (Tokyo) and Rei Satake (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyamideimide resin composition comprises a polyamideimide resin and a solvent containing a compound represented by formula (1). In the formula, R1 represents an alkyl group of 1 to 8 carbon atoms, R2 and R3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms, and X represents an alkylene group of 1 to 8 carbon atoms."

The patent was file...