US Patent Issued to RESONAC on Feb. 10 for "Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,074, issued on Feb. 10, was assigned to RESONAC Corp. (Tokyo).

"Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element" was invented by Yu Aoki (Tokyo), Yoshimi Hamano (Tokyo), Teruaki Suzuki (Tokyo) and Masahiro Hashimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cure...