US Patent Issued to RESONAC on Dec. 16 for "Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,636, issued on Dec. 16, was assigned to RESONAC Corp. (Tokyo).

"Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board" was invented by Hayato Sawamoto (Tokyo), Shuji Nomoto (Tokyo), Akihiro Nakamura (Tokyo), Kohei Otsuka (Tokyo) and Yuya Akiyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable...