US Patent Issued to Resonac on Aug. 18 for "Polishing liquid and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,699, issued on Aug. 18, was assigned to Resonac Corp. (Tokyo).

"Polishing liquid and polishing method" was invented by Daisuke Iikura (Tokyo) and Masako Aoki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing liquid containing: abrasive grains containing a hydroxide of a tetravalent metal element; a monovalent acid component having no carboxy group; and a non-ionic polymer, in which a pH is 4.5 or less. A polishing method including a step of polishing a surface to be polished by using this polishing liquid."

The patent was filed on Nov. 11, 2020, under Application No. 17/918,193.

*For further information, including images, charts an...