US Patent Issued to RESONAC on Aug. 18 for "Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,083, issued on Aug. 18, was assigned to RESONAC Corp. (Tokyo).

"Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor" was invented by Takashi Nakazawa (Tokyo), Hiroyuki Sakai (Tokyo), Masato Fukui (Tokyo), Kazuya Naritomi (Tokyo) and Tomoharu Yamazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the ...