US Patent Issued to RESONAC on April 21 for "Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,662, issued on April 21, was assigned to RESONAC Corp. (Tokyo).

"Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board" was invented by Kohei Otsuka (Tokyo), Hayato Sawamoto (Tokyo), Akihiro Nakamura (Tokyo) and Norihiko Sakamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound...