US Patent Issued to RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY on May 5 for "Shape-deformable and elastic bioadhesive electronic device and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,616,407, issued on May 5, was assigned to RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY (Suwon-si, South Korea).

"Shape-deformable and elastic bioadhesive electronic device and manufacturing method thereof" was invented by Donghee Son (Suwon-si, South Korea), Mikyung Shin (Suwon-si, South Korea), Sumin Kim (Suwon-si, South Korea) and Sungjun Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "One embodiment of the present invention provides a shape-deformable and elastic bioadhesive electronic device comprising a self-healing elastomeric polymer substrate, a stretchable thin-film electrode device, and a bioadhesive hydrogel lay...