US Patent Issued to Renesas Electronics on May 19 for "Semiconductor device including separated electrode pads and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,631,677, issued on May 19, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device including separated electrode pads and method of manufacturing the same" was invented by Takashi Tonegawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "First conductive layer is connected to an impurity region which is a source region or an emitter region. A first conductive layer having an emitter pad and a second conductive layer having a Kelvin emitter pad and a relay pad are separated. A plane occupied area of the Kelvin emitter pad is smaller than a plane occupied area of the emitter pad."

The patent was filed on Aug. 11, 2022, under Applicat...