US Patent Issued to RENESAS ELECTRONICS on March 17 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,016, issued on March 17, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Semiconductor device" was invented by Tatsuaki Tsukuda (Tokyo), Tomohiro Nishiyama (Tokyo), Toshiyuki Hata (Tokyo) and Koichi Hasegawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The on-resistance of a semiconductor device is reduced. A package structure composing the semiconductor device includes a die pad, a plurality of leads, a first semiconductor chip having a power transistor and mounted on the die pad, and a second semiconductor chip including a control circuit for controlling the power transistor and mounted on the first semiconductor chip. Here, a source...