US Patent Issued to Renesas Electronics on June 9 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,038, issued on June 9, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device" was invented by Katsuhiko Kitagawa (Tokyo), Takehiko Maeda (Tokyo), Kuniharu Muto (Tokyo) and Takeshi Miyakoshi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a die pad having an upper surface facing a semiconductor chip, a metal film formed on the upper surface, and a bonding material formed so as to cover the metal film. Here, the upper surface has: a first region overlapping the semiconductor chip, a second region not overlapping the semiconductor chip, a third region included in the first region and covered with...