US Patent Issued to RENESAS ELECTRONICS on Feb. 10 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,797, issued on Feb. 10, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Semiconductor device" was invented by Takashi Karashima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third conductive layer, a third insulating layer, and a fourth conductive layer. Given that an occupancy ratio of a first conductive pattern in the first conductive layer is a first occupancy ratio, an occupancy ratio of a second conductive pattern in the second conductive layer is a second occupancy ratio, an occupancy ratio of a th...