US Patent Issued to Renesas Electronics on Aug. 18 for "Pad metallization with oxide layer to reduce deformation of conductive films" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,960, issued on Aug. 18, was assigned to Renesas Electronics Corp. (Tokyo).

"Pad metallization with oxide layer to reduce deformation of conductive films" was invented by Takashi Moriyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pad electrode is formed in an uppermost wiring layer of a multilayer wiring layer formed on a semiconductor substrate. A dielectric film is formed to cover the pad electrode. An opening portion is formed in the dielectric film so as to reach the pad electrode. In the opening portion, a conductive film that is a part of a conductive layer is electrically connected to the pad electrode. On a side surface of the c...