US Patent Issued to Raytheon on March 3 for "Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies" (Massachusetts, Arizona Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,908, issued on March 3, was assigned to Raytheon Co. (Waltham, Mass.).

"Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies" was invented by Sergio V. Martinez (Sahuarita, Ariz.), Jeffrey R. Ogorzalek (Attleboro, Mass.) and Patrick J. Lott (Lowell, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the materia...