ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,907, issued on Sept. 15, was assigned to RadRock (Chongqing) Tech Co. Ltd. (Chongqing, China).
"Radio frequency front-end module" was invented by Yongjian Lei (Shenzhen, China), Yuan Cao (Shenzhen, China), Jie Gong (Shenzhen, China), Kaiyao Yu (Shenzhen, China), Chuanqiu Lei (Shenzhen, China) and Jianxing Ni (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The application discloses an RF front-end module. The second RF amplifier circuit and the third RF amplifier circuit are integrated in a second RF chip, and the first RF amplifier circuit is integrated in a first RF chip; the RF signals output by the first RF amplifier circuit and ...