US Patent Issued to QUALCOMM on Sept. 29 for "Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,306, issued on Sept. 29, was assigned to QUALCOMM Inc. (San Diego).

"Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods" was invented by Omar James Bchir (San Marcos, Calif.), Dongming He (San Diego), Ryan Lane (San Diego), Kuiwon Kang (San Diego) and Lily Zhao (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods are also disclosed. The cavity of the core (that has one or more core layers) of ...