US Patent Issued to QUALCOMM on Sept. 29 for "Reduced overhead beam profile characterization" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,750,804, issued on Sept. 29, was assigned to QUALCOMM Inc. (San Diego).

"Reduced overhead beam profile characterization" was invented by Weimin Duan (San Diego), Alexandros Manolakos (Escondido, Calif.), Jay Kumar Sundararajan (San Diego), Wanshi Chen (San Diego), Krishna Kiran Mukkavilli (San Diego) and Tingfang Ji (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are techniques for wireless communication. In an aspect, a method of wireless communication performed by a transmission/reception point (TRP) includes transmitting, at a first time and to a receiving entity, a first beam response report that describes, using a first level o...