US Patent Issued to QUALCOMM on Sept. 15 for "Die package with sealed die enclosures" (Dutch Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,918, issued on Sept. 15, was assigned to QUALCOMM Inc. (San Diego).

"Die package with sealed die enclosures" was invented by Bart Kassteen (Helden, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate."

The patent was filed on Sept. 14, 2022, under Application No. 17/932,209...