US Patent Issued to QUALCOMM on Sept. 1 for "Integrated device including direct memory attachment on through mold conductors" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,525, issued on Sept. 1, was assigned to QUALCOMM Inc. (San Diego).

"Integrated device including direct memory attachment on through mold conductors" was invented by Zhijie Wang (San Diego), Rajneesh Kumar (San Diego), Manuel Aldrete (Encinitas, Calif.), Sang-Jae Lee (San Diego) and Seongho Kim (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device includes a die including active circuitry and a first set of contacts; a first substrate including a second set of contacts and a third set of contacts on a first side of the first substrate and a fourth set of contacts on a second side of the first substrate; a mold compound dispos...