US Patent Issued to QUALCOMM on May 5 for "Techniques for sidelink and uplink full duplex communication with multiple transmission and reception points" (American, Chinese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,117, issued on May 5, was assigned to QUALCOMM Inc. (San Diego).

"Techniques for sidelink and uplink full duplex communication with multiple transmission and reception points" was invented by Hui Guo (Beijing), Kapil Gulati (Belle Mead, N.J.), Navid Abedini (Basking Ridge, N.J.), Junyi Li (Fairless Hills, Pa.), Sourjya Dutta (San Diego), Anantharaman Balasubramanian (San Diego) and Shuanshuan Wu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for sidelink (SL) and uplink (UL) full duplex communication with multiple transmission and reception points (multi-TRP) may be performed. In an example, a user equipment (UE) may determine fu...