US Patent Issued to QUALCOMM on May 5 for "Dual-connectivity architecture and setup procedures" (American, Chinese, Indian Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,879, issued on May 5, was assigned to QUALCOMM Inc. (San Diego).

"Dual-connectivity architecture and setup procedures" was invented by Karthika Paladugu (Hyderabad, India), Gavin Bernard Horn (La Jolla, Calif.), Hong Cheng (Basking Ridge, N.J.), Peng Cheng (Beijing) and Ozcan Ozturk (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A remote UE may detect one or more relay UEs for a dual connectivity configuration for communication with a first network entity and a second network entity. The dual connectivity configuration may include a primary connection with the first network entity and a secondary connection with the second network entity. T...