US Patent Issued to QUALCOMM on May 5 for "Back-compatible reconfigurable intelligent surface discovery via signatured wireless sensing" (California Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,042, issued on May 5, was assigned to QUALCOMM Inc. (San Diego).

"Back-compatible reconfigurable intelligent surface discovery via signatured wireless sensing" was invented by Yucheng Dai (San Diego), Wooseok Nam (San Diego) and Tao Luo (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first wireless node may transmit, to a reconfigurable intelligent surface (RIS), a first signal modulated using a first modulation signature, wherein the first modulation signature is an inverted modulation signature associated with a second modulation signat...