US Patent Issued to QUALCOMM on May 26 for "UL TDM carrier aggregation" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,596, issued on May 26, was assigned to QUALCOMM Inc. (San Diego).

"UL TDM carrier aggregation" was invented by Bo Chen (Beijing), Mingkai Nan (Beijing) and Hao Xu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wireless communication in a user device includes configuring a plurality of transmission chains with a plurality of carriers; and uploading data in a time-division duplexed (TDD) or frequency division duplex (FDD) transmission through the plurality of transmission chains. In some embodiments, two transmission chains and two carriers are used for carrier aggregation uplink of data. An apparatus may include a plurality of transmit chai...