US Patent Issued to QUALCOMM on May 19 for "Uplink transmissions in next available slots" (California, New York Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,934, issued on May 19, was assigned to QUALCOMM Inc. (San Diego).

"Uplink transmissions in next available slots" was invented by Konstantinos Dimou (New York), Yan Zhou (San Diego) and Tao Luo (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a network entity, a first downlink transmission associated with a first priority based at least in part on a first downlink grant. The UE may receive, from the network entity, a second downlink transmission associated with a second priority that is higher than the...