US Patent Issued to QUALCOMM on May 19 for "Architecture and protocol layering for sidelink positioning" (California, New Jersey Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,879, issued on May 19, was assigned to QUALCOMM Inc. (San Diego).

"Architecture and protocol layering for sidelink positioning" was invented by Stephen William Edge (Escondido, Calif.), Hong Cheng (Basking Ridge, N.J.) and Dan Vassilovski (Del Mar, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations, a user equipment (UE) may implement a ranging support protocol layer comprising one or more ranging support elements. The UE may communicate, using the one or more ranging support elements of the ranging support protocol layer, with a corresponding ranging support protocol layer in one or more other UEs, wherein the communicatin...