US Patent Issued to QUALCOMM on May 12 for "Sub-band full-duplex granularity" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,459, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Sub-band full-duplex granularity" was invented by Abdelrahman Mohamed Ahmed Mohamed Ibrahim (San Diego), Muhammad Sayed Khairy Abdelghaffar (San Jose, Calif.) and Ahmed Attia Abotabl (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a sub-band full-duplex (SBFD) pattern indication that indicates an SBFD pattern for an SBFD resource. The UE may identify a time domain granularity and a frequency domain granularity for the SBFD resource based at...