US Patent Issued to QUALCOMM on May 12 for "Deep trench capacitors (DTCs) employing bypass metal trace signal routing, and related integrated circuit (IC) packages and fabrication methods" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,429, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Deep trench capacitors (DTCs) employing bypass metal trace signal routing, and related integrated circuit (IC) packages and fabrication methods" was invented by Aniket Patil (San Diego), Hong Bok We (San Diego) and Joan Rey Villarba Buot (Escondido, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Deep trench capacitors (DTCs) employing bypass metal trace signal routing supporting signal bypass routing, and related integrated circuit (IC) packages and fabrication methods are disclosed. The DTC includes an outer metallization layer (e.g., a redistribution layer (RDL)) to provide a...