US Patent Issued to QUALCOMM on May 12 for "Decoupled uplink and downlink communications via reconfigurable intelligent surfaces" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,361, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Decoupled uplink and downlink communications via reconfigurable intelligent surfaces" was invented by Hung Dinh Ly (San Diego), Yu Zhang (San Diego), Saeid Sahraei (San Diego) and Krishna Kiran Mukkavilli (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. The described techniques support decoupled uplink and downlink communications via reconfigurable intelligent surfaces. Generally, the described techniques provide for using different passive network nodes for uplink and downlink communications. A user equ...