US Patent Issued to QUALCOMM on March 31 for "Physical layer preamble design for special packet types" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,237, issued on March 31, was assigned to QUALCOMM Inc. (San Diego).

"Physical layer preamble design for special packet types" was invented by Jialing Li Chen (San Diego), Sameer Vermani (San Diego), Bin Tian (San Diego) and Lin Yang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure provides methods, devices and systems for generating packet preambles. Some implementations more specifically relate to preamble designs for special cases such as, for example, full-bandwidth multi-user multiple-input multiple-output (MU-MIMO), single-user (SU) preamble puncturing, hybrid automatic repeat request (HARQ), and multi-AP coordination....