US Patent Issued to QUALCOMM on March 3 for "Tile level interconnect design for central processing unit image access patterns" (Indian, American Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,709, issued on March 3, was assigned to QUALCOMM Inc. (San Diego).

"Tile level interconnect design for central processing unit image access patterns" was invented by Keshava Prasad Nagaraja (Bangalore, India), Shivanand Shashikanth Aski (Bagalkot, India), Krishnaprasad Mahendrakar (Bangalore, India), Andrew Edmund Turner (San Diego) and Siddesh Halavarthi Math Revana (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the disclosure are directed to providing access to multimedia data in a tile format. In accordance with one aspect, the disclosure includes detecting one or more dependencies of a first tile read request with a ...