US Patent Issued to QUALCOMM on March 3 for "Apparatus and methods for binding a system on chip and a memory device with a key" (Indian Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,868, issued on March 3, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for binding a system on chip and a memory device with a key" was invented by Yashavantha Rao (Hyderabad, India), Debasish Mandal (Hooghly, India) and Manohar Kallutla (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses directed to providing multi-key support within die architectures, such as System-on-a-Chips. In some examples, a die package includes key activation fuses, key revocation fuses, and key fuses for multiple keys. The die package also includes a processor electrically coupled to the key activation fuses, the key ...