ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,713, issued on March 17, was assigned to QUALCOMM Inc. (San Diego).
"Via alternate net spacing" was invented by Thomas Hua-Min Williams (Irvine, Calif.), Luis Chen (Chula Vista, Calif.) and Bed Raj Kandel (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip includes a first net, and a second net, wherein the first net and the second net are formed from a same metal layer, and the second net neighbors the first net. The chip also includes first vias disposed on the first net, and second vias disposed on the second net. A first spacing is greater than a second spacing, the first spacing is between a first one of the first vias and a secon...