US Patent Issued to QUALCOMM on March 17 for "Apparatus and methods for securing integrity and data encryption link sessions within die interconnect architectures" (Indian Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,017, issued on March 17, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for securing integrity and data encryption link sessions within die interconnect architectures" was invented by Ravindranath Doddi (Hyderabad, India), Sanchana Vasan S (Coimbatore, India) and Umamaheshwaran V (Salem, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses are provided to detect errors within device link sessions, and to disable the link sessions based on the detected errors. In one example, a die includes a non-transitory, machine-readable storage medium storing instructions. The die also includes at least one processor c...