US Patent Issued to QUALCOMM on June 2 for "Apparatus and methods for establishing link bandwidths within die interconnect architectures" (Indian, American Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,645,629, issued on June 2, was assigned to QUALCOMM Inc. (San Diego).

"Apparatus and methods for establishing link bandwidths within die interconnect architectures" was invented by Santhosh Reddy Akavaram (Hyderabad, India), Sang Tran (Encinitas, Calif.), Vydhik Sharma Devaraju (Karimnagar, India), Chintalapati Bharath Sai Varma (Hyderabad, India), Radhakrishna Mugada (Hyderabad, India) and Pradeep Cherukoori (Wyra, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses are provided that can establish data links with greater bandwidths within die-to-die interconnect architectures. In one example, a system-on-a-chip (SoC) includes an...