US Patent Issued to QUALCOMM on June 16 for "Managing interlaced sidelink feedback" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,659,979, issued on June 16, was assigned to QUALCOMM Inc. (San Diego).

"Managing interlaced sidelink feedback" was invented by Chih-Hao Liu (San Diego), Jing Sun (San Diego), Giovanni Chisci (San Diego) and Xiaoxia Zhang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. The described techniques provide for determining whether to drop an additional signal at an edge interlaced resource block (IRB) of a common interlace. A user equipment (UE) may transmit additional signals via IRBs of the common interlace to improve an occupied channel bandwidth (OCB) of a feedback transmiss...