US Patent Issued to QUALCOMM on July 15 for "Transmitting overlapping uplink transmissions using a power scaling factor" (Japanese, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,642, issued on July 15, was assigned to QUALCOMM Inc. (San Diego).

"Transmitting overlapping uplink transmissions using a power scaling factor" was invented by Kazuki Takeda (Tokyo), Peter Gaal (San Diego), Timo Ville Vintola (San Diego), Juan Montojo (San Diego), Gokul Sridharan (Sunnyvale, Calif.) and Wanshi Chen (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit, to a network node, a first uplink transmission using a first transmit power that is based at least in part on: a first power level associated w...